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Semiconductor Solutions

ZEISS Axio Imager Vario

Near-line Lab Microscope For Automated Wafer-scale Analysis And Review
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The Need for AI-Powered Microscopy in Semiconductor Analysis, Review, and Reporting

In the fast-paced semiconductor manufacturing environment, the need to review wafers efficiently and accurately is critical. Modern optical microscopes can perform a variety of physical analysis, metrology and defect review tasks, and this flexibility is now available for near-line semiconductor analyses with the option of automated wafer handling. Combining the Axio Imager Vario and ZEISS ZEN and Blockwise software with integrated AI modules facilitates the automated collection and analysis of a wide range of measurements. Users can generate comprehensive reports that highlight defect patterns and trends, enabling them to identify root causes and implement corrective actions. This data-driven approach fosters continuous improvement in wafer production.

AI Landscape for Microscopic Imaging

AI transforms microscopy by enabling faster, more accurate analysis of extensive datasets.

  • Machine Learning (ML): Algorithms learn from data to make predictions, relying on feature engineering to extract relevant information.
  • Deep Learning (DL): A powerful subset of ML, DL excels in complex segmentation tasks, anomaly detection and defect classification. 

AI-Powered Analysis

When paired with ZEISS software, the Axio Imager Vario can leverage AI algorithms for automated object detection and classification. By training AI models on extensive datasets of wafer images, the software learns to recognize various object types, such as designed structures, defects such as foreign particles or scratches, and manufacturing process errors. This automation not only speeds up the review process but also enhances detection accuracy, reducing the variability of human error.

Consistency and Accuracy

Automated measurement solutions provide consistent and accurate results, reducing the variability associated with human inspections. The integration of AI algorithms within the ZEISS ZEN software architecture combined with the high-resolution optical microscope from the Axio Imager Vario ensures that measurements are uniform, regardless of the operator’s experience level. This consistency is crucial for maintaining high-quality standards in semiconductor manufacturing.

Real-Time Reporting

Automated systems can generate real-time reports on product quality metrics and defect types, allowing manufacturers to respond quickly to issues as they arise. This immediate feedback loop enables timely adjustments to the manufacturing process, minimizing waste and improving overall efficiency. The ZEISS ZEN software platform with AI routines can analyse data from the Axio Imager Vario and provide actionable insights, facilitating continuous improvement.

Make Faster Yield Decisions, With Automated Wafer-scale Analysis And Review

Move from inspection data to action, faster and more consistently. Discover how you can automate defect review, classification and reporting with the ZEISS Axio Imager Vario and ZEN software with integrated AI modules. The ZEISS Axio Imager Vario microscope is a powerful tool for semiconductor manufacturers, providing metrology data and high-resolution imaging with an array of contrast techniques eg. DIC, BF and FL.

  • AI-Powered Automated Wafer Defect Detection and Reporting

    • Automatically identify and classify defect types, with high-resolution image acquisition across the wafer.
    • Configure automated inspection recipes to capture a defined number of defects or target specific wafer locations.
    • Generate structured reports categorizing defects, with clear visualization on wafer maps for rapid analysis.

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    This video shows an example of KLARF Navigation

    Built For Fab Workflows

    • Reads KLARF format files from dedicated inspection tools and lists identified objects.
    • Converts wafer coordinates to microscope coordinates for automatic stage movement.
    • Considers die pitch, die origin, die index, sample centre, and individual defect attributes (relative x and y positions).
    • Automatically navigates to a selection of defects and can acquire an image of each defect.

  • Critical Dimension Metrology

    • Metrology software interface for automated image capture /loading and reporting
    • Employs Advanced algorithms for automatic edge detection and feature fitting
    • Multiple measurement options available for reliable statistical data visualization and extraction in table format
    • AI built architecture for automatic identification and image capture on specific features and edges

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    This video shows an example of GDS Navigation

    GDS Navigation (Utilises Klayout)

    • Define regions of interest.
    • Select the layer and automatically acquire it using predefined settings.
    • Automatically calculate a tile region if the areas exceed the microscope’s field of view.
    • Optionally send images to Pro SEM for dimensional metrology.
    • Send acquired images back to Klayout for comparison with the GDS layout.

  • Develop Your Own Workflow

    Build automated workflows with an intuitive visual programming tool. ZEISS Blockwise extends your microscope to automate control, navigation, image analysis, and measurements—turning complex, operator‑dependent tasks into standardized processes.

    Its drag‑and‑drop interface enables even non‑programmers to create custom workflows—boosting productivity, throughput, and accuracy while reducing manual errors and variability through smart automation.

  • PVA-TePla Waferloader UL200

    Compact wafer loading system designed in partnership with PVA TePla
    • Built-in SECS/GEM connectivity
    • Integrated Cassette RFID tag reading
    • Integrated WaferID reading (QR-code, barcode, OCR, )
    • Optional Top-Bottom-Makro visual inspection facility
    • Small footprint as tabletop solution
    • Capable to handle 4”, 6” and 8” wafers
    • Capable to handle two wafer sizes simultaneously
    • Manual and automated operation modes

Automated Wafer Loading

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Axio Imager Vario with Wafer Loader

Scale Wafer Review Without Scaling Effort

Automate defect review across up to 25 wafers per cassette—eliminating manual inspection bottlenecks. Operators shift from logging defects to analysing trends, enabling better decisions and improved yield outcomes.

Leveraging the ZEISS Solutions Lab Team

From concept to deployment - ZEISS Solutions Lab delivers complete, ready-to-run wafer review solutions.

Integrated Automated Wafer-Scale Microscopy Analysis

The semiconductor industry demands highly precise, application-specific defect and wafer review, where complexity and throughput vary across processes. ZEISS Solutions Lab accelerates deployment by developing and optimising automated review workflows for the Axio Imager Vario, combining advanced imaging and AI-driven analysis. The result: faster adaptation for improved yield, and consistent high-quality inspection in a competitive manufacturing environment.

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