With the slowing of Moore’s Law, there has never been more urgency to address challenges for integrated circuit (IC) package characterization and failure analysis (FA) in the More than Moore (MtM) era. Diverse IC package strategies exist to enable the highest system performance. As a result, package developers and failure analysts are faced with complex package architectures, shrinking package interconnect pitches on the order of a few microns, and system-on-chip (SOC) disintegration, which leads to larger package footprints approaching 100mm x 100mm or larger. These trends drive requirements for new capabilities across the entire FA workflow.
This session is designed for those working in Electronics Materials Characterization, Electronics Failure Analysis & Electronics Packaging.
- An introduction to the "More-than-Moore" (MtM) packaging trend
- How 3D X-ray microscopy is used to address the challenge of MtM package analysis
- Technical highlights of the ZEISS "Packaging FIB" for improvement of FA workflow
Cheryl Hartfield is Product Marketing Manager for ZEISS Microscopy, based in Dublin, California. She received her MA and BS in Microbiology from UT Southwestern Medical Center, and Texas A&M, respectively. She co-founded Omniprobe and was Senior Member of Technical Staff at Texas Instruments, working for 12 years in characterization and package development. Cheryl is an ASM Fellow and Past President of EDFAS. She has 15 patents and authored >70 papers.