Inspect Your Electronics Package Non-destructively and in 3D With X-rays

As electronic devices become increasingly complex and miniaturized, ensuring their reliability and performance is more critical than ever. Traditional inspection methods often fall short when it comes to revealing internal structures without destructive testing. This webinar will explore how high-resolution X-ray computed tomography (CT) provides a powerful, non-invasive solution for analyzing packaged electronic components, enabling engineers and researchers to visualize internal features in unprecedented detail.

We will discuss the principles of X-ray CT and its application to electronics packaging, including the detection of voids, cracks, solder joint integrity, and material interfaces. Through real-world examples, attendees will learn how CT imaging can uncover hidden defects and manufacturing inconsistencies that impact device reliability. The session will also highlight how CT data can be integrated into quality assurance workflows and failure analysis processes.

Whether you are involved in electronics design, manufacturing, or reliability testing, this webinar will demonstrate how X-ray CT can transform your approach to inspection and analysis. Join us to discover how this technology is driving innovation in electronics and helping organizations reduce risk, improve quality, and accelerate development cycles.

Benefits of Attending

• Learn about the benefits of non-destructive imaging with X-rays
• Discover how X-ray CT can improve analysis workflows for packaged devices
• Hear from an industry expert on how they are using X-ray CT
  

Date: 19th March 2026
Time: 10:00 - 11:00 GMT