Event

ZEISS Elyra

UK User Group Meeting
Bioscience Technology Facility, University of York
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Image by University of York

Event Summary

Our upcoming User Group Meeting will bring together selected Elyra Users for the opportunity to share research findings, applications and technology insights. You will be able to meet other ZEISS Elyra users and to hear how they leverage the Elyra for their research purposes.

Over the two days we will have a varied program of informative and practical presentations from users and technical experts. There will be time for Q&A, round table discussions and opportunities for networking.

Event Dates:

  • Start Time: 11th January 2024 (11:00)
  • End Time: 12th January 2024 (14:00)

Would you like to give a talk at the meeting? ​Sharing your experience with the Elyra User community is a great way to spread knowledge and gain exposure for the work being done in your lab. We invite you to seize this opportunity by submitting a request to share your recent results with the group during the meeting. Your talk should be a ten minute presentation followed by five minutes for questions.​ Simply submit your abstract during registration. You will also have the opportunity to suggest topics for discussion when completing the registration form below.

During the meeting you can expect:

  • Informative Roundtable Discussions
  • Impactful Research Presentations
  • Technology Insights From Experts
  • Collaboration and Networking Opportunities

Registration is free. The deadline for registration and abstract submission is Monday 18th December 2023.

Location & Directions

Bioscience Technology Facility, University of York

Image by Freepik

Discounted Hotel Rate

Our partners at the University of York have negotiatied a discounted hotel rate at the Hotel Indigo York starting from £96 per night. It is conveniently located located on one of York's oldest streets, in the Walmgate neighbourhood. Click below to take advantage of this special rate and to visit the hotel website for more information. 

Address
88 - 96 Walmgate, York, YO1 9TL. United Kingdom

Register To Attend

Complete the form below to book your place. We invite attendees to share their work with other users, simply submit your abstract for consideration when registering via the form below. The deadline for registration and abstract submission is Monday 18th December 2023. Registration is free.

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Register

Complete the short form below to register today. We will send additional updates including speaker announcements and other important information to the contact details provided. Registration closes February 12, 2024.

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Register To Attend

Complete the form below to book your place. We invite attendees to share their work with other users, simply submit your abstract for consideration when registering via the form below. The deadline for registration and abstract submission is April 14th, 2025. Registration is free.

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Agenda

  • 11:30 - 12:30

    Registration and Lunch

    12:30 - 12:40

    Welcome and Opening Remarks

    12:40 - 13:25

    High-throughput, Operando SEM for Device Materials Process Discovery - Professor Stephan Hoffman (University of Cambridge)

    Scanning Electron Microscopy Session

    Electronic Materials Characterisation Session

    13:30 - 13:50

    Thin Samples in the SEM - Dr. Gareth Hughes (Universtiy of Oxford)

    Advancing Ga2O3 Integration: Heterogeneous Approaches with Diamond and SiC for High-Voltage Power Devices - Indraneel Sanyal (University of Bristol)

    13:50 - 14:10

    Automated Analysis with Mineralogic: 2D to 3D Mineral Characterisation - Dr. Jessica Berry (University of Plymouth)

    Electron Diffraction in the SEM for Electronic Materials and Devices Characterization - Dr. Naresh Gunasekar (University of Cardiff)

    14:10 - 14:30

    Evolution of Gemini Optics - Dr. Benjamin Tordoff (Carl Zeiss Ltd.)

    A multi-microscopy study of III-V QD lasers - Eve Burgess (University of Cardiff)

    14:30 - 15:00

    Break

    Focused Ion Beam & Image Analysis Session

    Electronics Advanced Failure Analysis Techniques Session

    15:00 - 15:20

    Digital Image Correlation with Focused Ion Beam Microscopy - Dr. Alexander Lunt (University of Bath)

    Combining three-dimensional FIB-SEM imaging and EBIC to characterize power semiconductor junctions - Heiko Stegmann and Greg Johnson (Carl Zeiss Ltd.)

    15:20 - 15:40

    Hercules: The Story So Far - Dr. Gareth Douglas (University of Leicester)

    Unpacking the nanoprobing signals that arise from electron beam interactions with electronic devices - Greg Johnson (Carl Zeiss Ltd.)

    15:40 - 16:00

    Understanding 3D Volumetric Analysis of Active MOF Embedded in Thin Film Polymer - Andy Holwell (Carl Zeiss Ltd.)

    Further Discussion and Q&A - All Participants

    16:00 - 18:30

    Drinks Reception and Hercules Facility Tours

    18:30

    Dinner

  • 09:00 - 09:45

    Microscopy Tools for Augmented Reality Research - Dr. Jamie Reynolds (WaveOptics)

    10:00 - 10:50

    Demo - GeminiSEM 560 for Ultra Low kV Imaging

    Analytics and Correlation Session

    10:50 - 11:10

    A Correlative Microscopy workflow for Nanoscale Failure Analysis in Electronic Packages - Dr. Thomas Rodgers (Carl Zeiss Gmbh)

    11:10 - 11:30

    Multi-modal Analysis with EDS, EBSD & Raman - Dr. Dan Haspel (Oxford Instruments Plc) 

    11:30 - 11:50

    Correlative X-ray to Electron Microscopy of Leafcutter Ant Cuticular Armour - Prof Richard Johnston (Swansea University)

    11:50 - 12:20

    Break

    12:20 - 13:20

    Demo - XRM to Crossbeam Laser Workflow

    13:20 - 13:50

    Community Feedback Session

    13:50 - 14:00

    Closing Session

    14:00 - 15:30

    Lunch

Featured Speakers

We were pleased to have an experienced speaker line up for this meeting. You can expect to hear from speakers who are at the forefront of cutting-edge EM technology in various specialty fields at our future user group meetings. Below we have a selection of featured speaker bios from the event line up.

Speaker Dr. Alexander Lunt Senior Lecturer, Department of Mechanical Engineering, University of Bath

Dr Alexander Lunt is a Senior Lecturer in Mechanical Engineering at the University of Bath. He is a world leader in micromechanics (90+ publications) with a focus on technique development using microscopy and non-destructive testing. The application base for his work is broad and includes multilayers, composite materials, additively manufactured systems, batteries and more. He has secured substantial funding (£4m+) in collaboration with his extensive academic and industrial research network (GKN, Dowty, Rolls Royce, etc..). Dr Lunt co-directs Bath’s Integrated Materials and Structures research centre and is principal investigator in the University’s collaboration with CERN. Additionally, he is the Imaging and Microscopy user representative at Diamond Light Source, and is Composites Lead Editor for the Elsevier Journal Materials & Design.

Speaker Dr. Naresh Gunasekar Lecturer, Condensed Matter and Photonics Group, School of Physics and Astronomy, Cardiff University

Dr. Naresh Gunasekar is a lecturer in compound semiconductor device technology at Cardiff University, leading a research group on developing energy-efficient wide bandgap optical and electronic devices, particularly troubleshooting their reliability issues via correlative micro-spectroscopy. He completed his PhD from Strathclyde University in 2012 on developing and applying “Electron Channelling Contrast Imaging for III-nitride semiconductors” and is currently a fellow of the Royal Microscopical Society.

Speaker Eve Burgess PhD student, School of Physics and Astronomy, Cardiff University

I’m Eve Burgess, from Oldham in Greater Manchester. I am a second year PhD student at Cardiff University – as part of the EPSRC CDT in Compound Semiconductor Manufacturing- supervised by Dr Juan Pereiro Viterbo, also working closely with the Cardiff University Optoelectronics group. My PhD project is in collaboration with Zeiss to develop a multi-microscopy study of III-V compound semiconductor devices, so far mainly focusing on understanding the reliability of quantum dot (QD) lasers.

Speaker Dr. Dan Haspel Market Segment Manager, Materials Analysis, Oxford Instruments

Dan is the Market Segment Manager for Materials Analysis at Oxford Instruments, where he was previously a Product Scientist at NanoAnalysis, where he specialised in EBSD and FIB applications. Dan came to Oxford Instruments mid-2022 and was previously a Technical Specialist at Plymouth Electron Microscopy Centre, where he managed their Crossbeam 550. Dan went to Loughborough Uni for both his undergraduate Masters degree and his PhD, both in materials.

Speaker Greg Johnson Senior Application Development Engineer, Carl Zeiss Ltd

Greg has a BS degree from Virginia Tech and performed some graduate research at the University of Florida. At IBM’s Packaging Development Laboratory, he honed his FA skills in packaging, and was soon named an Inventor on 19 US Patents in greensheet formulation and sintering. Then, at IBM’s Semiconductor Research and Development Center, he was either the lead or sole FA engineer for FEOL defect localization across seven, successful, bulk technology node qualifications. And one in SOI. Now at Carl Zeiss Microscopy, he is developing applications in electron and ion microscopy for the semiconductor industry.

Speaker Dr. Jamie Reynolds Senior Nanophotonic Engineer, WaveOptics

Jamie Reynolds is an optical engineer in the Nanophotonics Technology team at Wave Optics / Snap Inc. His background is in nanoelectronics and nanophotonics. He studied at University of Southampton for his PhD in graphene single electron transistors and moved into postdoc researching NEMS and then Silicon photonics before he moved to Wave Optics 3 years ago.

Speaker Dr. Indraneel Sanyal Research Associate, Center for Device Thermography and Reliability (CDTR), H. H. Wills Physics Laboratory, University of Bristol

Indraneel Sanyal is currently a Research Associate at the University of Bristol's Centre for Device Thermography and Reliability (CDTR), specializing in the advancement of state-of-the-art Ultrawide bandgap power devices. With a focus on epitaxial growth, Indraneel has dedicated the past eight years to working on ultra/wide bandgap semiconductors such as GaN and Ga2O3, utilizing techniques like molecular beam epitaxy (MBE) and metal organic chemical vapor deposition (MOCVD).

  

Indraneel's journey began in 2015 at the Indian Institute of Technology, Kharagpur (IITKGP), India, where he developed GaN-on-Si technology using MBE for high-power transistors. From 2016 to 2021, during his Ph.D. in Taiwan, Indraneel played a pivotal role in the design, growth, and characterization of cutting-edge wide bandgap devices including quaternary AlInGaN for GaN-on-Si based RF devices. His contributions extended to technology transfer with the Industrial Technology Research Institute (ITRI), Taiwan, and Lexter.

  

Acknowledged for excellent graduate research, Indraneel received Taiwan's prestigious CTCI Foundation award in 2020. Actively fostering international collaboration, Indraneel has played a key role in connecting with renowned institutions such as the Tokyo Institute of Technology and the Indian Institute of Technology (Mandi). In Bristol, Indraneel actively engages in grant applications, notably as a Researcher Co-investigator in projects like the EPSRC Horizon with a considerable funding of approximately £200k, focusing on novel van-der-Waal epitaxy of Ga2O3.

Join Us for the 2025 UK EM User Group Meeting!

We are excited to invite you to the second annual UK Electron Microscopy User Group Meeting, tailored exclusively for the UK research community. Following the success of last year’s event, we’re back with an even broader agenda in collaboration with the University of Liverpool.

Why Attend?
This meeting fosters knowledge exchange, expands understanding of materials and electronic components, and introduces cutting-edge technologies in microscopy and multiscale characterization. New for 2025, we’ve incorporated X-Ray Microscopy(XRM) and advanced workflows in response to your valuable feedback.

Event Highlights

  • Expert Presentations: Hear from leading researchers and ZEISS experts on topics like lab automation, cryo workflows, FIBSEM workflows, and machine learning applications in materials science.
  • Facility Tours: Explore Liverpool’s state-of-the-art SEM and X-Ray Microscopy Shared Research Facilities, featuring instruments like the Gemini 450 FEG SEM and Versa 620.
  • Live Demonstrations: Witness ZEISS microscopes in action during remote demos.
  • Networking Opportunities: Connect with peers from academia and industry.

What’s in It for You?

  1. Gain insights into the latest trends and innovations in Electron and X-ray microscopy.
  2. Engage with a community of materials scientists and industry professionals.
  3. Learn from real-world applications in 3D imaging, batteries, cement, and beyond.

Event Details
Dates: 26th–27th February 2025
Location: Liverpool Metropolitan Cathedral & University of Liverpool
Agenda: Academic talks, live demos, facility tours, and a community feedback session.

Don’t miss this opportunity to explore cutting-edge research, network with like-minded professionals, and elevate your expertise in materials characterization.

Secure Your Spot Today!
Spaces are limited—register now to be part of what promisies to be a dynamic event!

Live Virtual Demos

We were pleased to demo three of our most versatile electron microscopes and to give the opportunity to ask our specialists your questions during these interactive sessions. Read on to learn more about what was covered during the live demo sessions.
  • ZEISS GeminiSEM 560
    High resolution image of montmorillonite particles obtained at 800 V beam energy. Even though the sample is non-conductive, fine flakes on the fractured surface can be well resolved.
    Image 1. ZEISS GeminiSEM 560 Image 2. High resolution image of montmorillonite particles obtained at 800 V beam energy. Even though the sample is non-conductive, fine flakes on the fractured surface can be well resolved.

    ZEISS GeminiSEM 560

    During the "GeminiSEM 560 for Ultra Low kV Imaging" demo, you will see high performance even under low kV conditions on challenging, non-conductive samples. You will also see that ease-of-use was principle in the design of this instrument and this will help you to obtain research-grade images on even the most challenging specimens.

    The GeminiSEM 560 is the pinnacle of field emission scanning electron microscopy (FESEM) at ZEISS. It is the ultimate high-resolution low-kV FESEM, featuring best resolution of 0.8 nm at 1 kV - achieved without the need for sample bias or source monochromation.

    The GeminiSEM 560 features the Gemini III electron column, the latest evolution of our tried and tested Gemini electron column. As with the Gemini I column, which celebrated its 30th anniversary in 2023, the Gemini III column features beam booster and electrostatic final lens. This is already designed for low kV performance. The Gemini III column also includes a nanotwin lens to provide the additional boost in performance. This lens even results in lower emission of magnetic fields than the Gemini I column.

  • ZEISS Crossbeam Laser
     These images (five in total) illustrate the preparation of an atom probe tomography (APT) sample using ZEISS Crossbeam laser. The sample is silicon. A specific site of the sample was marked by an ion beam induced deposition and prepared. First, a pillar is isolated from the bulk by laser machining. Next, the sample is shaped by FIB milling in steps.
    Image 1. ZEISS Crossbeam Laser Image 2. This image illustrates the preparation of an atom probe tomography (APT) sample using ZEISS Crossbeam laser. The sample is silicon. A specific site of the sample was marked by an ion beam induced deposition and prepared. First, a pillar is isolated from the bulk by laser machining. Next, the sample is shaped by FIB milling in steps.

    ZEISS Crossbeam Laser

    During the "XRM to Crossbeam Laser Workflow" demonstration, you will see how the Crossbeam Laser can correlate with the data from the Xradia Versa, using it to target a specific region buried deep below the sample surface. The femtosecond laser works quickly to remove the bulk material whilst maintaining a surface finish suitable for EBSD mapping.

    The ZEISS Crossbeam combines imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation Ga+ focused ion beam (FIB). Users can take advantage of ZEISS Crossbeam’s modular platform concept and high number of accessory ports to upgrade your system for any growing needs, e.g. with the LaserFIB for massive material ablation.

    The femtosecond laser ablation module allows rapid access of deeply buried regions of interest, execution of correlated workflows across multiple length scales and acquisition of better sample representativity with large-volume analysis. The rapid preparation capability allows for faster 3D imaging (including analytics) workflows and the improved surface finish means reduced or no additional milling to achieve desired imaging in some cases.

  • ZEISS Xradia 630 Versa
    Image 1. ZEISS Xradia 630 Versa Image 2. Large field of view 3D X-ray scan of package-on-package (POP) from a smartphone main control board imaged at 10 μm/ voxel.

    ZEISS Xradia Versa 3D X-ray Microscope

    During the "XRM to Crossbeam Laser Workflow" demonstration, you will see how the Xradia Versa produces high resolution 3D datasets. The data will be used to identify a region of interested that is buried below the sample surface. This data can be correlated with the Crossbeam Laser, which can expose the region and perform the desired subsequent analysis.

    Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM features dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.