 Digital Mirror Device
Digital Mirror Device (DMD), aluminum. 3D surface topography.
Epiplan-Apochromat 50x/0.95; 55.1 µm x 55.1 µm x 11.9 µm,
512 x 512 pixels x 126 sections.
Sample: Dr. Faust,
Fraunhofer Institute for Reliability and Microintegration, Berlin/Chemnitz, Germany |
| Digital Mirror Device |
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 Lab-on-a-chip die
Lab-on-a-chip die (steel alloy) for the hot stamping of glass components.
Multiple Stack Scan from 12 x11 stacks.
EC Epiplan-Neofluar 20x/0.5; 4964.6 µmx 4554.7µmx116mm,
2180 x 2000 pixels x 30 sections.
Sample: Prof. Uhlmann, Institute for Machine-Tools and Factory Management,
Technical University, Berlin, Germany |
| "Lab-on-a-Chip"-for the hot stamping of glass components |
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| | You have mastered the processes of thin-film and thick-film fabrication. You are familiar with modern assembling and packaging technologies. You know that microsystems engineering means more than just airbag sensors, and that the scanning electron microscope is only one of the tools for analyzing and characterizing materials.
Use the advantages of non-contact optical surface analysis.
Navigate with speed and certainty – from the millimeter to the submicrometer range.
Measure your microstructures with the
LSM 700 – either with sample-preserving light in the green-to-red spectral region, or with blue for maximum optical resolution.
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